ec3sm-b-20-30.000m tr ec3sm -b -20 -30.000m tr series 4.0mm epoxy base smd crystal frequency tolerance/stability 50ppm at 25c, 100ppm over 0c to +70c mode of operation bt-cut fundamental packaging options tape and reel nominal frequency 30.000mhz load capacitance 20pf parallel resonant electrical specifications nominal frequency 30.000mhz frequency tolerance/stability 50ppm at 25c, 100ppm over 0c to +70c aging at 25c 5ppm/year maximum load capacitance 20pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 40 ohms maximum mode of operation bt-cut fundamental drive level 1mwatts maximum storage temperature range -40c to +85c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 connected to pin 3 3 connected to pin 2 4 crystal line marking 1 e30.000 e=ecliptek designator www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 1 of 4 marking orient a tion 4.95 max 12.5 max 1.3 0.1 (x4) 9.0 0.1 4.0 max 1.2 0.1 2.0 ref 1 2 4 3
ec3sm-b-20-30.000m tr 6.7 1.3 2.2 (x4) 2.3 (x4) www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 2 of 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
dia 50 min dia 20.2 min dia 13.0 0.2 2.5 min width 10.0 min depth t ape slot in core f or t ape star t dia 40 min access hole at slot location 1.5 min tape & reel dimensions *compliant to eia 481a ec3sm-b-20-30.000m tr 24.0 0.3 11.5 0.1 10.75 0.10 4.0 0.1 2.0 0.1 12.0 0.1 5.4 0.1 dia 1.5 0.1 12.5 0.1 0.40 0.05 4.2 0.1 30.4 max 360 max quantity per reel: 1,000 units 24.4 +2.0/-0 www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ec3sm-b-20-30.000m tr low temperature infrared/convection 225c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 225c maximum target peak temperature (tp target) 225c maximum 2 times time within 5c of actual peak (tp) 80 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev r 8/12/2010 | page 4 of 4
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